The company is a leading provider of power semiconductor devices in China, specializing in the research, development, design, and sales of high-performance power semiconductor devices. Notably, its WLCSP (Wafer-level Chip-scale Package) product stands out as one of the company's main offerings. This product boasts advanced semiconductor packaging technology and is renowned for its compact size, excellent thermal performance, and impact resistance. The company operates using a unique "fab-lite" model, strategically combining the flexibility of outsourcing standardized manufacturing with in-house manufacturing capabilities. This approach enables the company to maintain supply chain flexibility and achieve strict cost and quality control. The company's fab-lite model offers two core differentiating advantages that set it apart from traditional fabless and IDM companies: Unlike fabless companies that typically outsource all packaging processes, the company possesses its own advanced packaging capabilities (especially in WLCSP technology), allowing it to optimize costs and enhance performance. Unlike IDM companies that typically operate with heavy assets to complete all wafer manufacturing processes in-house, the company selectively retains control over specific, high-value-added wafer manufacturing processes, balancing the flexibility of asset-light operations with direct control over key wafer manufacturing processes.
According to the information from Zero2IPO Consulting, the company is one of the few power semiconductor device suppliers in China that possesses both key wafer manufacturing processes and advanced internal capabilities in packaging and testing.